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PCB Assembly That’s Built To Perform At Any Volume
SMT, through-hole, mixed technology, BGA, and conformal coating with IPC-A-610 compliant processes, multi-stage inspection, and full unit-level traceability. Whether you need 10 boards in 48 hours or 100,000 for a product launch, we deliver consistent quality every time.
Trusted by teams that can’t afford failure
99
.8%
First pass yield
100
K+
Boards per month
24–48
H
Quick-turn prototype
Up to
40
Layer count
Every PCB assembly technology. One expert partner
Whatever your board design demands - we have the technology, process expertise, and quality systems to deliver it right, at any volume.
Surface mount technology (SMT)
Through-hole technology (THT)
Mixed technology assembly
GA & µBGA assembly
Conformal coating
NPI & quick-turn prototyping
Surface mount technology (SMT)
High-speed, high-precision placement for complex, high-density boards from 01005 passives to large ICs and fine-pitch components.
  • Dual-lane lines at 100,000+ CPH
  • Fine-pitch and 01005 passive placement
  • Nitrogen reflow with 10-zone profiling
  • 3D SPI and post-reflow AOI
Through-hole technology (THT)
Reliable through-hole assembly for components requiring mechanical strength or high-power handling ideal for industrial, automotive, and power electronics.
  • Automated and manual insertion
  • Wave and selective soldering
  • Lead-free and RoHS compliant
  • IPC-A-610 Class 2 and Class 3
Mixed technology assembly
SMT and THT on the same board - our most common assembly type, requiring precise process sequencing and inspection at every stage.
  • Optimised SMT + THT sequencing
  • Selective soldering on populated boards
  • Full IPC-compliant inspection throughout
  • Suitable for complex multi-layer designs
GA & µBGA assembly
Advanced ball grid array assembly with precise temperature profiling and 100% X-ray verification for complex, high-density designs where visual inspection is insufficient.
  • Min BGA pitch 0.3mm
  • 100% X-ray verification on all BGA joints
  • Precise reflow temperature profiling
  • CSP and flip-chip capability
Conformal coating
Protective coating for PCBs operating in harsh environments - high humidity, airborne contaminants, and extreme temperature variations.
  • Spray and selective coating methods
  • Component masking available
  • Suitable for automotive, industrial, and outdoor applications
  • Acrylic, silicone, and polyurethane coatings
NPI & quick-turn prototyping
Dedicated fast-track lanes for new product introductions and prototype builds so your first boards get the same attention as a full production run, just faster.
  • 4–48h quick-turn capability
  • Dedicated NPI resource assigned
  • DFM review included at proto stage
  • Seamless scale-up to production
Every PCB assembly technology. One expert partner
Whatever your board design demands - we have the technology, process expertise, and quality systems to deliver it right, at any volume.
Surface mount technology (SMT)
Surface mount technology (SMT)
High-speed, high-precision placement for complex, high-density boards from 01005 passives to large ICs and fine-pitch components.
  • Dual-lane lines at 100,000+ CPH
  • Fine-pitch and 01005 passive placement
  • Nitrogen reflow with 10-zone profiling
  • 3D SPI and post-reflow AOI
Through-hole technology (THT)
Through-hole technology (THT)
Reliable through-hole assembly for components requiring mechanical strength or high-power handling ideal for industrial, automotive, and power electronics.
  • Automated and manual insertion
  • Wave and selective soldering
  • Lead-free and RoHS compliant
  • IPC-A-610 Class 2 and Class 3
Mixed technology assembly
Mixed technology assembly
SMT and THT on the same board - our most common assembly type, requiring precise process sequencing and inspection at every stage.
  • Optimised SMT + THT sequencing
  • Selective soldering on populated boards
  • Full IPC-compliant inspection throughout
  • Suitable for complex multi-layer designs
GA & µBGA assembly
GA & µBGA assembly
Advanced ball grid array assembly with precise temperature profiling and 100% X-ray verification for complex, high-density designs where visual inspection is insufficient.
  • Min BGA pitch 0.3mm
  • 100% X-ray verification on all BGA joints
  • Precise reflow temperature profiling
  • CSP and flip-chip capability
Conformal coating
Conformal coating
Protective coating for PCBs operating in harsh environments - high humidity, airborne contaminants, and extreme temperature variations.
  • Spray and selective coating methods
  • Component masking available
  • Suitable for automotive, industrial, and outdoor applications
  • Acrylic, silicone, and polyurethane coatings
NPI & quick-turn prototyping
NPI & quick-turn prototyping
Dedicated fast-track lanes for new product introductions and prototype builds so your first boards get the same attention as a full production run, just faster.
  • 4–48h quick-turn capability
  • Dedicated NPI resource assigned
  • DFM review included at proto stage
  • Seamless scale-up to production
Advanced technology on the line
Modern SMT, inspection, and thermal systems ensuring repeatable, measurable quality run by IPC-trained operators on every line.
High-speed SMT lines
Dual-lane lines capable of 100,000+ CPH handling 01005 passives, large ICs, and fine-pitch components with full traceability logs.
Advanced X-ray inspection (AXI)
Non-destructive verification of BGA/QFN solder voiding and wire-bond integrity essential for hidden joint verification on complex assemblies.
3D AOI & SPI
Volumetric inspection of solder paste and placed components preventing defects at the source, before reflow, when correction is cheapest.
Nitrogen reflow ovens
10-zone reflow profiling with N₂ atmosphere delivering superior solder wetting, joint quality, and oxidation prevention on complex boards.
Flying probe & ICT
Flexible flying probe testing for low-volume and NPI builds plus in-circuit testing for high-volume programmes requiring fast, repeatable electrical verification.
Selective soldering system
Precision selective soldering for THT components on mixed-technology boards maintaining SMT component integrity while achieving reliable through-hole joints.
Advanced technology on the line
Modern SMT, inspection, and thermal systems ensuring repeatable, measurable quality run by IPC-trained operators on every line.
High-speed SMT lines
Dual-lane lines capable of 100,000+ CPH handling 01005 passives, large ICs, and fine-pitch components with full traceability logs.
Advanced X-ray inspection (AXI)
Non-destructive verification of BGA/QFN solder voiding and wire-bond integrity essential for hidden joint verification on complex assemblies.
3D AOI & SPI
Volumetric inspection of solder paste and placed components preventing defects at the source, before reflow, when correction is cheapest.
Nitrogen reflow ovens
10-zone reflow profiling with N₂ atmosphere delivering superior solder wetting, joint quality, and oxidation prevention on complex boards.
Flying probe & ICT
Flexible flying probe testing for low-volume and NPI builds plus in-circuit testing for high-volume programmes requiring fast, repeatable electrical verification.
Selective soldering system
Precision selective soldering for THT components on mixed-technology boards maintaining SMT component integrity while achieving reliable through-hole joints.
Why leading product teams choose us for PCB assembly
There are hundreds of PCB assembly houses. Here’s what makes the difference when your product can’t afford to fail.
Engineering-led assembly
Our production team thinks like engineers flagging DFM issues, optimising component placement, and catching design risks before they become production problems.
99.8% first pass yield
Robust process controls, 3D SPI, and AOI at every critical stage delivering a consistently high first pass yield that keeps your programme on schedule.
Dedicated NPI support
New product introductions get a dedicated resource so your first production run gets the same attention as your thousandth, not a generic queue slot.
Full traceability at every volume
Component-level traceability from goods-in to finished board with complete documentation for regulated industries including medical and automotive.
Integrated with wire harness & box build
Your PCB assembly programme can seamlessly extend into wire harness, box build, and testing - all under one roof, with one accountable partner.
Scalable from prototype to mass production
Same quality systems, same traceability, same team, whether you're building 10 boards for validation or 100,000 for a product launch.
Engineering-led assembly
Our production team thinks like engineers flagging DFM issues, optimising component placement, and catching design risks before they become production problems.
99.8% first pass yield
Robust process controls, 3D SPI, and AOI at every critical stage delivering a consistently high first pass yield that keeps your programme on schedule.
Dedicated NPI support
New product introductions get a dedicated resource so your first production run gets the same attention as your thousandth, not a generic queue slot.
Full traceability at every volume
Component-level traceability from goods-in to finished board with complete documentation for regulated industries including medical and automotive.
Integrated with wire harness & box build
Your PCB assembly programme can seamlessly extend into wire harness, box build, and testing - all under one roof, with one accountable partner.
Scalable from prototype to mass production
Same quality systems, same traceability, same team, whether you're building 10 boards for validation or 100,000 for a product launch.
Nothing ships until it passes
Every PCB assembly goes through a structured, multi-stage inspection and testing protocol aligned to your industry’s standards and your product’s specific requirements.
3D solder paste inspection (SPI)
Volumetric paste verification before placement to prevent defects at source
Automated optical inspection (AOI)
100% post-reflow coverage for solder, alignment, and polarity defects
Advanced X-ray inspection (AXI)
BGA, QFN, and hidden solder joint verification
Burn-in & environmental stress screening
Surfacing early-life failures before units reach your customers Final visual inspection and ESD-safe packaging before despatch
Flying probe testing
Flexible electrical verification for NPI and low-volume builds
Functional testing
End-to-end performance validation under real operating conditions
In-circuit testing (ICT)
Electrical verification of every assembled board
3D solder paste inspection (SPI)
Volumetric paste verification before placement to prevent defects at source
Automated optical inspection (AOI)
100% post-reflow coverage for solder, alignment, and polarity defects
Advanced X-ray inspection (AXI)
BGA, QFN, and hidden solder joint verification
Burn-in & environmental stress screening
Surfacing early-life failures before units reach your customers Final visual inspection and ESD-safe packaging before despatch
Flying probe testing
Flexible electrical verification for NPI and low-volume builds
Functional testing
End-to-end performance validation under real operating conditions
In-circuit testing (ICT)
Electrical verification of every assembled board
Maximise yield. Minimise total cost
We leverage DFM reviews, BOM engineering, and lean manufacturing practices to reduce your landed cost without compromising on reliability or performance.
DFM & DFA at design stage
Early design-for-manufacturing and design-for-assembly inputs catch cost drivers before they’re locked in reducing rework, scrap, and redesign cycles downstream.
BOM engineering & alternate sourcing
Our sourcing team reviews your BOM for cost reduction opportunities identifying qualified alternates and leveraging global supplier relationships for better pricing.
Lean production scheduling
Optimised production scheduling and fast changeover capability reducing idle time, minimising WIP, and keeping your programme cost-efficient at any volume.
In-line defect prevention
3D SPI and AOI at every critical stage catches defects before they compound reducing scrap, rework cost, and the risk of field returns.
PCB assembly for industries where failure is not an option
Automotive
IPC Class 3, AEC-Q200 compliant, full traceability
Medical Devices
ISO 13485 flow support, documentation-heavy, precision assembly
Aerospace & defence
Stringent process controls for mission-critical systems
Telecom
High-density, high-reliability assemblies for network infrastructure
Industrial
Ruggedised assemblies for harsh, continuous-operation environments
Consumer electronics
High-volume, cost-optimised builds with consistent cosmetic quality
PTH to hybrid SMD redesign - 450-component BOM converted to 70% SMD for better stability and lower cost.
Problem
A client was running an ageing through-hole PCB design with a 450-component BOM facing higher assembly costs, larger board size, component availability challenges, and reliability limitations inherent to a fully leaded design.
Solution
We redesigned the entire PCB converting 70% of components from PTH to SMD to create a hybrid design, replacing components where better modern equivalents existed, and optimising the layout for improved thermal performance and assembly efficiency.
Outcome
Hybrid PCB delivered with improved stability, reduced assembly cost, and a more manufacturable design achieving the client's cost-down objective without compromising product performance.
450-component BOM · 70% SMD conversion · cost reduction achieved
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